3 days ago · The topic of thin glass especially for new applications in architecture attracted a great deal of interest among trade visitors at the past glasstec and its special show "glass technology live". On behalf of
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The integration of passive components using double-side and ultra-thin glass interposers with small TPVs, enables one to shrink RF module size. AB - 3D Integrated Passive and Actives
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Jul 1, 2018 · Abstract. Double-side or 3-D integration of high-precision and high-performance bandpass and lowpass filters that are interconnected with through-vias were designed and
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Glass substrates offer a promising alternative to traditional LTCC and organic substrates for RF applications due to their low loss, high dimensional stability, and cost-effectiveness. Double
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3 days ago · The topic of thin glass especially for new applications in architecture attracted a great deal of interest among trade visitors at the past glasstec and its special show "glass
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Triple TPS® IG units with ultra-thin center glass as thin as 0.5 mm are significantly lighter than traditional triple IG units Ideal replacement for existing double units with compact thin triple units Very attractive for
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May 19, 2017 · This paper goes beyond prior work to demonstrate ultra-miniaturized RF components such as capacitors, inductors and low pass filters, towards a more complete 3D
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May 21, 2024 · Introduction Recently several double-glass (also called glass–glass or dual-glass modules) c-Si PV modules have been launched on the market, many of them by major PV
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Glass substrates offer a promising alternative to traditional LTCC and organic substrates for RF applications due to their low loss, high dimensional stability, and cost-effectiveness. Double-sided 3D integration on thin glass
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May 29, 2015 · This paper demonstrates 3D functional modules that are ultra-miniaturized, high-performance and low-cost, based on an innovative 3D Integrated Passive and Active
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Jul 1, 2018 · TPVs in thin glass enable double-side integration of active and thinfilm passive components on either sides of the glass substrate, thus reducing the X-Y footprint of the
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Double-side thin-film components on glass provides additional design flexibility, higher component density, and simultaneous double-side fabrication with structural balance, allowing thin glass substrate manufacturing with minimal warpage.
Recently several double-glass (also called glass–glass or dual-glass modules) c-Si PV modules have been launched on the market, many of them by major PV manufacturers. These modules use a sheet of tempered glass at the rear of the module instead of the conventional polymer-based backsheet. There are several reasons why this structure is appealing.
It was observed that the performance of the designed diplexer on glass substrates with organic thin films was vulnerable to dielectric thickness variation. For large-scale manufacturing of this thin glass substrate technology, copper thickness and dielectric thickness should be controlled with precision.
High-precision, high quality factor, and high component densities with thin-film layers on glass were used to realize innovative topologies on glass for high out-of-band rejection and low insertion loss. Low-loss 100-μm thick glass cores and multiple layers of 15-μm thin polymer films were used to build the filters on substrates.
Precise fine-line patterning capability, excellent multilayer alignment, and thin-film thickness control were achieved, resulting in less than 5% process tolerance. The good agreement between the characterized diplexer performance and EM simulation results demonstrate the 3-D IPD concept on thin glass substrates.
The glass-based 3-D IPDs harness all the electrical and mechanical performance benefits that glass substrate technologies can offer. Such IPDs can be innovatively designed with thin-film elements and double-side embedded onto 100-μm thin glass, as shown in Fig. 1.
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